The PFL\DPAK Pneumatic Forming Machine is tailored for shaping DPAK components with adjustable parameters, capable of forming them into a gull-winged shape. This equipment pre-processes components for easy assembly, featuring a pneumatic die press for optimal precision and consistency. It streamlines component completion and forming simultaneously.
For forming component lead into Ω shapes
Specially designed for bottom lead component forming, the forming parameters are manually adjustable, multiple devices can be formed at one time.
The pneumatic forming system utilizes the P-5000 pneumatic press, capable of down-pressure forming to eliminate the instability associated with manual presses. Featuring an adjustable frame cutter and a single-side forming mold, it efficiently cuts lead frames and shapes various sizes of flat packaged chips. This cost-effective system is ideal for small-batch, multi-variety production in institutional and military settings.
The Pneumatic One-side Forming System PFL-1M utilizes the P-5000 pneumatic press to eliminate the instability associated with manual forming. Complete with an adjustable lead cutter and a one-side forming mold, it efficiently cuts leads and forms various sizes of flat packaged chips. This cost-effective system is ideal for small-batch and multi-variety production needs.
This equipment utilizes a double-acting cylinder paired with an electrified proportional valve for precise control of two cylinders, ensuring cutting accuracy. It employs a high-precision digital display lifting table for adjusting component height, enabling the cutting of lead to various lengths to meet diverse requirements. Operated through a simple foot switch control mode, it is specially designed for cutting the lead of specific components with adjustable lengths, primarily catering to DIP component lead cutting needs.
The M60W is primarily utilized for wedge bonding across a range of applications including hybrid circuits, MCM multichip modules, optical devices, microwave devices, laser devices, and discrete devices. Featuring a height-adjustable workbench, it accommodates different wire bonding materials such as aluminum wire, gold wire, and gold ribbon. Additionally, it offers the capability to export bonding programs onto flash disks for convenient storage, boasting ample storage capacity.
Heating plate series is apply to weld between component and substrate ,substrate and shell in process of microelectronics packaging and assembly such as: hybrid circuit、optical fiber electronic device. Technical Parameter …
VTP200 can be used for eutectic sintering of microwave component, microwave module and TR module. It can provide inert gas protection. LCD touch screen shows process parameters. Technical Parameter Desktop …
Applicable to SOP or QFP component lead cutting before forming
