The Problem This Machine Solves
Component tinning restores solderability to aged, oxidized, or gold-plated leads — but doing it by hand with a solder pot and tweezers introduces uncontrolled immersion depth, inconsistent dwell time, and operator-dependent temperature management. The result: variable tin thickness, thermal damage to sensitive components, and solder bridges on fine-pitch packages. The Super Tinning system automates the tinning process with precision motion control, automatic loading, and computer-managed process parameters — delivering consistent, documented tinning quality across every component.
Precision Motion — X/Y/Z + 360° Rotation
The Super Tinning provides four-axis motion control — X, Y, Z linear axes plus 360° rotation. This gives complete control over immersion angle, depth, and withdrawal speed. For QFP packages, the rotation axis allows all four sides to be tinned in a single cycle by rotating the component through the solder bath. High-precision screw rod motion achieves repeatability of ±0.05 mm — critical for fine-pitch components where immersion depth directly affects tin thickness.
Key Specifications
| Motion Axes | X, Y, Z linear + 360° rotation — four-axis precision control |
| Repeatability | ±0.05 mm — high-precision screw rod motion |
| Automation | Automatic loading/unloading of SMT components |
| Positioning | Automatic center positioning and outline identification |
| Process Control | Solder temperature, immersion depth, travel speed, dwell time, simultaneous moves |
| Agitation | Agitation motion for effective alloy removal |
| Rotation | Automated rotation for QFP — all four sides in one cycle |
| Detection | Automatic result detection — verify tinning quality |
| Atmosphere | Nitrogen protection — prevents oxidation during tinning |
| Data | Automatic data record for quality tracing — data management and communication interface |
Applications
- Gold removal and re-tinning — stripping gold plating and replacing with solder coating on QFP, SOP, QFN
- Solderability restoration — re-tinning oxidized or aged component leads
- QFP multi-side tinning — automated rotation for all four sides in a single cycle
- SMT component tinning — automatic loading/unloading for production throughput
- Lead-free conversion — converting SnPb-plated components to lead-free solder coating
- Quality-critical tinning — documented process parameters for MIL-STD and aerospace applications
- Agitation-assisted tinning — effective gold and oxide removal through controlled agitation
How It Works
Step 1 — Loading and Identification: Components are loaded into the automatic feeder. The vision system identifies component outline and center position — compensating for any feeding misalignment.
Step 2 — Flux Application: Component leads are coated with flux to promote solder wetting. Flux type and application are process-controlled.
Step 3 — Immersion and Tinning: The four-axis motion system immerses the component into the solder bath at the programmed depth, angle, and dwell time. For QFP packages, the rotation axis cycles the component through the bath for all-side coverage. Agitation motion enhances gold and oxide removal. Nitrogen atmosphere prevents oxidation during the process.
Step 4 — Withdrawal and Inspection: The motion system withdraws the component at controlled speed — withdrawal speed directly affects tin thickness and uniformity. Automatic result detection verifies tinning quality. Data is logged for quality tracing.
Super Tinning vs. Alternatives
| Feature | Super Tinning | Hyper Tinning | Manual Dip Tinning |
|---|---|---|---|
| Motion | 4-axis — X/Y/Z + 360° rotation | Automated — high-capacity | Manual — operator hand |
| Repeatability | ±0.05 mm | High — automated | Poor — operator dependent |
| QFP rotation | Automated — all 4 sides | Automated | Manual — one side at a time |
| Vision system | Yes — automatic center + outline | Yes — visual recognition | No |
| Nitrogen protection | Yes | Likely | No |
| Data logging | Full — quality tracing + communication | Computer managed | None |
| Agitation | Yes — for alloy/oxide removal | Basic | No |
| Throughput | Medium — precision focused | High — production speed | Low |
| Best for | Precision tinning, varied components | High-volume gold removal | Prototyping, rework |
What to Send for a Quote
- Component types — QFP, SOP, QFN, other; body sizes and lead counts
- Gold plating spec — gold thickness if known
- Tin coating spec — target thickness, alloy (SnPb or lead-free)
- Throughput requirement — components per hour or shift
- Rotation requirement — QFP multi-side tinning needed?
- Quality spec — IPC-J-STD-002, MIL-STD-883, or internal spec
- Data logging — quality tracing requirements
Target Industries
Semiconductor packaging, OSAT facilities, high-reliability electronics assembly, defense/aerospace, medical devices, telecommunications, any facility requiring precision component tinning with documented process control.
Related Equipment
- Hyper Tinning — high-capacity automated gold removal for production-speed tinning
- Hydro-clean AS — post-tinning cleaning to remove flux residue
- NanoVapor — precision cleaning of tinned components before assembly