The Problem This Machine Solves
The Hydro-clean LDS delivers excellent low stand-off cleaning, but its fixed single-frame configuration doesn’t suit every production environment. High-volume lines need doubled throughput without doubling the machine footprint. Mixed-product lines need quick changeover between board sizes. The LDS-S solves both: it takes the same linear direct spray technology and packages it in single-frame or double-frame configurations that match your actual production layout.
Single-Frame vs. Double-Frame
Single-frame: One board cleaned per cycle. Lower footprint, lower cost. Ideal for mixed-product lines where board dimensions change frequently, or for facilities where floor space is constrained.
Double-frame: Two boards cleaned simultaneously in the same cycle. Approximately 2× the throughput of single-frame without doubling the machine footprint. Ideal for high-volume lines running consistent board sizes where throughput is the priority.
Key Specifications
| Spray Technology | Linear direct spray — optimized for low stand-off gap penetration |
| Configurations | Single-frame or double-frame |
| Double-Frame Throughput | ~2× single-frame — two boards per cycle |
| Target Standoff | Down to 0.05mm (0.002 in) — BGA, QFN, CSP, BTC, MELF, flip-chip |
| Cleaning System | Fully automatic, closed-loop, zero-drain |
| DI Water System | 100% filtration of entire DI water circuit |
| Drying Technology | Hot air knife — direct impingement |
| Rinse Options | Standard double rinse; optional triple rinse |
| Pipeline Design | Fully isolated — wash, rinse, dry circuits separated |
| Fixturing | Standard and custom PCBA fixtures; stencil clamping |
| Monitoring | Glass observation door; proportional level sensors |
Control System: Windows OS with touchscreen HMI — programmable recipe storage/recall, cycle data logging, password-protected process parameters, and exportable production records for traceability (IPC-6012, MIL-STD-883, AS9100).
Applications
- High-volume low stand-off cleaning — double-frame for doubled throughput on BGA/QFN/CSP assemblies
- Mixed-product production — single-frame for quick changeover between different board sizes
- Production scaling — start with single-frame, add double-frame capacity as volume grows
- BGA cleaning — flux residue removal under ball grid array packages
- QFN/DFN cleaning — thermal pad flux residue under exposed-pad packages
- Pre-coating preparation — conformal coating adhesion under bottom-termination components
- Pre-wirebond cleaning — contamination removal before wire bonding on hybrid assemblies
How It Works
The cleaning process is identical to the standard LDS: heated chemistry spray penetrates low stand-off gaps, DI water rinse removes contamination, hot air knife drying eliminates moisture. The difference is in the fixture configuration.
Single-frame mode: One fixture holds one board. The spray cycle covers the entire board surface. Total cycle time: wash + rinse + dry — typically 8–15 minutes depending on contamination level and board complexity.
Double-frame mode: Two fixtures hold two boards side by side. The spray system covers both boards simultaneously in the same cycle. Total cycle time is similar to single-frame, but throughput doubles because two boards are processed per cycle. The independent liquid pipelines ensure both boards receive identical cleaning exposure.
Hydro-clean LDS-S vs. Alternatives
| Feature | LDS-S (Double-Frame) | LDS (Single) | AS (Single) | Manual Batch |
|---|---|---|---|---|
| Low stand-off cleaning | Optimized — 0.05mm | Optimized — 0.05mm | Good — not optimized | Poor |
| Throughput per cycle | 2 boards | 1 board | 1 board | 1 board |
| Changeover flexibility | Yes — single or double | Fixture swap only | Fixture swap only | Manual |
| Floor space | Compact — same footprint as LDS | Standard | Standard | Minimal |
| Zero discharge | Yes | Yes | Yes | No |
| Scalability | Start single → add double | Fixed | Fixed | Add operators |
What to Send for a Quote
- Board dimensions — maximum and minimum length × width × thickness
- Configuration preference — single-frame, double-frame, or both
- Low stand-off packages — BGA, QFN, CSP types and minimum standoff height
- Throughput requirement — boards per hour; confirm if double-frame is needed
- Flux type — rosin, water-soluble, no-clean
- Cleanliness specification — IPC-6012 class, MIL-STD-2000, or internal spec
- Changeover frequency — how often board sizes change during a shift
Target Industries
High-volume EMS providers, automotive electronics, telecom infrastructure, medical device manufacturing, defense/aerospace, any facility running mixed-product SMT lines with BGA/QFN/CSP assemblies.
Related Equipment
- Hydro-clean LDS — the base LDS platform with triple cleaning capacity and 5 sub-step flexibility
- Hydro-clean AS — automatic PCBA cleaning with AGV integration for automated production lines
- Hydro-clean LTS — triangle spray for high-volume batch cleaning where throughput matters more than low-stand-off penetration