Semi-Automatic Bonder PW22 — Wire Bonding for Lab & Small-Batch Production

Semi-Automatic Wire Bonder PW22

The PW22 semi-automatic wire bonder is designed for laboratory work, prototype assembly, and small-batch production environments. It supports both ball bonding and wedge bonding modes on a single platform, with an 8-inch LCD touchscreen interface running Windows OS for programmable recipe storage, process documentation, and recipe recall.

For microelectronics engineers evaluating wire bonding capability, the PW22 covers the most common bonding requirements without the footprint, cost, or complexity of a fully automated production bonder. One bonding head handles both ball/wedge and wedge/wedge configurations — swap the blade and switch modes.

Key Specifications

Bonding ModesBall bonding, wedge bonding — switchable via blade replacement
Wire MaterialsGold wire: 17–75 μm (0.0007–0.003″)
Aluminum wire: 17–75 μm (0.0007–0.003″)
Gold ribbon: up to 25 × 250 μm (0.001″ × 0.010″)
Deep AccessWedge bonding: 16 mm (0.63″)
Ball bonding: 13 mm (0.51″)
Touchscreen8-inch LCD touchscreen with Windows OS
Program StorageUp to 100 programs with USB backup
Wire LoopEditable wire loop profiles
Z/Y AxisMotor-driven for consistent placement
OptionsPick-up/Place module, Pull Testing module

Control System: Windows OS with touchscreen HMI — programmable recipe storage/recall, cycle data logging, password-protected process parameters, and exportable production records for traceability (IPC-6012, MIL-STD-883, AS9100).

What the PW22 Covers

Bonding capability: Gold and aluminum wire wedge bonding, gold ball bonding, gold ribbon bonding. One head handles both ball/wedge and wedge/wedge — change the blade to switch modes.

Programmable recipes: Store up to 100 bonding programs with USB backup. Editable wire loop profiles allow you to tune loop height, span, and shape per recipe. Motor-driven Z/Y axis ensures repeatable placement across batches.

Deep access: 16 mm clearance for wedge bonding heads, 13 mm for ball bonding — sufficient for most hybrid circuits, MCMs, and package-level work without custom tooling.

Primary Applications

  • Hybrid microelectronics assembly
  • RF and microwave module wire bonding
  • Prototype IC packaging
  • Multi-chip module (MCM) assembly
  • Sensor and MEMS packaging
  • Optical device assembly
  • University and R&D laboratory bonding
  • Failure analysis and qualification testing
  • Aerospace and defense hybrid circuits
  • Low-volume production runs

When to Choose the PW22

The PW22 fits operations that need programmable wire bonding but don’t require the throughput of a fully automated production line. Typical users run 10–500 bonds per day across multiple recipes, need traceable process data, and value the ability to switch between ball and wedge modes without dedicated machines.

For higher-volume requirements (1,000+ bonds/day), evaluate fully automated bonders from ASMPT, Kulicke & Soffa, or Hesse Mechatronics. The PW22 occupies the sweet spot between manual bench-top bonding and production automation.

What to Include in a Quote Request

  1. Wire material and diameter (gold wire, aluminum wire, gold ribbon — with gauge)
  2. Bonding mode(s) needed (ball, wedge, or both)
  3. Package types and lead pitch
  4. Deep access requirement (max standoff height)
  5. Daily bond volume estimate
  6. Traceability/data logging requirements
  7. Pull testing and pick-up/place needs
  8. Quality standard (IPC-6012, MIL-STD-883, internal spec)

Configuration should be confirmed during application review.

Target Industries

Semiconductor packaging, hybrid microelectronics, RF/microwave modules, aerospace/defense electronics, medical devices, university research labs, failure analysis facilities, and prototype assembly environments.

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