The Vapor SUI Mini 2 is a compact vapor phase cleaning machine designed for precision, water-free cleaning of microelectronics assemblies. It uses spray-under-immersion technology with double-flow cleaning in a smaller footprint — ideal for labs, prototype lines, and low-volume production where floor space is limited but cleaning performance cannot be compromised.
Why Vapor SUI Mini 2 Exists
Many facilities need vapor phase cleaning capability but cannot justify a full-size system — labs running process development, prototype shops building first articles, or production lines with limited floor space. The Vapor SUI Mini 2 delivers the same spray-under-immersion technology as larger systems in a compact package.
Key Specifications
| Cleaning Technology | Spray-under-immersion with double-flow cleaning |
| Footprint | Compact — reduced floor space vs. full-size systems |
| Ultrasonic | Optional 132 kHz — not required for standard cleaning |
| Basket Oscillation | Yes — mechanical agitation for enhanced penetration |
| Vapor Rinsing | Multiple cycles supported |
| Solvent Management | Condensation system + sealing design |
| Construction | Stainless steel, closed-loop system |
| Process Control | Programmable cleaning cycles |
Control System: Windows OS with touchscreen HMI — programmable recipe storage/recall, cycle data logging, password-protected process parameters, and exportable production records for traceability (IPC-6012, MIL-STD-883, AS9100).
Applications
- Micro gap ultra-precision flux cleaning — stand-off gaps below 0.3mm (0.012″)
- Microwave component cleaning — frequency-sensitive assemblies where trace contamination affects performance
- Micro assembly module cleaning — hybrid circuits, sensors, multi-chip modules
- Pre-packaging cleaning — before encapsulation or molding
- Post-lead-tinning cleaning — removing flux residue after component tinning
- Water-free environments — facilities with wastewater discharge restrictions
How It Works
The Vapor SUI Mini 2 combines spray-under-immersion with basket oscillation to achieve effective cleaning without ultrasonic energy. Solvent is pumped through spray nozzles while the part is immersed, forcing cleaning agent into micro-gaps and blind holes. Basket oscillation provides additional mechanical action. Multiple vapor rinse cycles can be programmed for applications requiring higher cleanliness levels.
When to Choose Vapor SUI Mini 2
| Consideration | Vapor SUI Mini 2 | Vapor SUI 2 | NanoVapor |
|---|---|---|---|
| Footprint | Compact | Full-size | Full-size |
| Vacuum operation | No | No | Yes — full vacuum cycle |
| Throughput | Low to medium | Medium to high | Low to medium |
| Best for | Labs, prototypes, low-volume | Production, mixed products | Maximum penetration, blind holes |
| Co-solvent option | No | No | No |
Related Equipment
- NanoVapor — vacuum vapor phase for maximum penetration in blind holes and complex geometries
- Vapor SUI 2 — full-size spray-under-immersion for production volumes
- Hydro-clean LDS — aqueous PCBA cleaning for standard stand-off assemblies