A NIST announcement on extreme-environment photonic chip packaging highlights a broader electronics manufacturing trend: advanced applications require clean, repeatable, high-reliability assembly processes.
The RO water treatment process stands as one of the most advanced methods globally for generating high-purity deionized water. Renowned for its low operating costs, economic efficiency, user-friendly operation, and reliability, it emerges as the ideal option for end-users. Our DI-water system can produce high-purity deionized water with an electrical resistivity of 10 M Ω · cm, making it suitable for various industries including electronics, pharmaceuticals, and more.
This system is a printed circuit board cleaning system that combines excellent cleaning effects, low cleaning agent consumption, high efficiency drying, zero wastewater discharge, easy maintenance, and extremely short downtime. The Hydro clean Array is very suitable for RMA and non cleaning flux applications that require chemical agents, as well as for removing water-soluble organic acid flux.
Remove various flux residues, clean small mechanical components, remove contamination from PCB production, and remove FOD. Clean high-density electronic components with low stand-off components, such as BGA, CSP.BTC, QFN, and MELF. Clean power devices and sensitive electronic devices, clean misprints with complex components, and clean before coating and bonding.
Remove flux or moderately soluble solder residue from PCB boards, remove fingerprint contamination during PCB manufacturing, and remove FOD. Clean misprints with complex components, clean before coating. Clean the tray and remove oil contamination from mechanical components.
Remove flux or moderately soluble solder residue from PCB boards
Remove fingerprint contamination during PCB manufacturing
Remove FOD
Cleaning misprints with complex components
Clean before coating
Clean the tray
Remove oil contamination from mechanical components
Used for cleaning PCB after soldering, PCBA before coating, power devices and micro mechanical components. A special filtering system with high flow, which can be set as closed-loop or open-loop in the software, and the first rinse and second rinse system are completely independent.
The Vapor SUI is meticulously crafted to meet customer cleaning specifications while leveraging our company’s wealth of cleaning application expertise. It efficiently cleans electronic assemblies and precision mechanical components. Constructed from high-performance stainless steel, it endures heavy workloads while ensuring safety and environmental friendliness, minimizing solvent loss and cutting equipment operating costs. The fully closed-loop system of the Vapor SUI prevents any waste discharge.
The through-hole forming machine is primarily employed in aerospace for forming leads of various axial components, with customizable lead ranges tailored to specific customer requirements. This equipment facilitates pre-processing of axial components for easy positioning and welding, enhancing efficiency. Equipped with a display showing holding pressure duration and movement gap in each direction, it ensures optimal accuracy and consistency, delivering clean, burr-free lead cutting.
LRS-1 can recondition component leads side by side. Improve the coplanarity and stand-off height. The coplanarity is able to achieve 0.05mm.
