The M60W is primarily utilized for wedge bonding across a range of applications including hybrid circuits, MCM multichip modules, optical devices, microwave devices, laser devices, and discrete devices. Featuring a height-adjustable workbench, it accommodates different wire bonding materials such as aluminum wire, gold wire, and gold ribbon. Additionally, it offers the capability to export bonding programs onto flash disks for convenient storage, boasting ample storage capacity.
Equipment Features
- WINDOWS system, easy to operate
- Optional adaptive microscope system
- Deep access bonding capability
- X, Y, Z operating lever, flexible operation, convenient for bonding at different heights
- Compatible with wire diameters: Gold wire: 17-75 μm, Aluminum wire: 20-76 μm, Gold ribbon: Up to 25×250 μm