The Vapor SUI 2 is a vapor phase cleaning machine built for the hardest cleaning challenge in electronics manufacturing: removing flux residue, organic contamination, and particulates from under low stand-off packages where water-based processes fail. It combines spray-under-immersion technology with double-flow cleaning to penetrate micro-gaps without ultrasonic energy — protecting sensitive die while achieving complete contamination removal.
Why Vapor SUI 2 Exists
When a board includes BGA, QFN, flip-chip, or CSP packages, the stand-off gap between the package bottom and the board surface drops below 0.3mm (0.012″). Water’s surface tension (~72 mN/m) physically cannot penetrate these gaps. Flux residue gets trapped, causing corrosion, dendritic growth, and field failures.
The Vapor SUI 2 uses spray-under-immersion with low-surface-tension solvents (~13-20 mN/m) to dissolve and remove contamination from these micro-gaps. The double-flow system delivers up to 300L/min (79 gal/min) of cleaning action without requiring ultrasonic energy — which can damage sensitive die and wire bonds.
Key Specifications
| Cleaning Technology | Spray-under-immersion + double-flow cleaning |
| Flow Rate | Up to 300L/min (79 gal/min) |
| Ultrasonic | Optional 132 kHz — not required for standard cleaning |
| Basket Oscillation | Yes — mechanical agitation for enhanced penetration |
| Vapor Rinsing | Multiple cycles supported for process flexibility |
| Solvent Management | Dual condensation system + dual sealing design |
| Construction | High-performance stainless steel, fully closed-loop |
| Waste Discharge | Zero — water-free process, no wastewater |
| Customization | Custom baskets and fixtures available |
| Control | Flexible process cycle programming |
Control System: Windows OS with touchscreen HMI — programmable recipe storage/recall, cycle data logging, password-protected process parameters, and exportable production records for traceability (IPC-6012, MIL-STD-883, AS9100).
Applications
The Vapor SUI 2 is designed for components and assemblies where conventional cleaning falls short:
- BGA cleaning — flux residue removal under ball grid array packages (stand-off gaps 0.1-0.3mm / 0.004-0.012″)
- QFN and BTC cleaning — perimeter gap and center thermal pad contamination (gaps 0.05-0.15mm / 0.002-0.006″)
- Flip-chip (FC) cleaning — sub-100μm (0.004″) stand-off gap penetration
- CSP cleaning — chip-scale package flux residue removal
- MELF cleaning — metal electrode leadless face component cleaning
- 3D packaging cleaning — stacked die with micro-gap interconnections
- Bare die cleaning — surface preparation before wire bonding or die attach
- SIP and microwave module cleaning — frequency-sensitive assemblies where trace contamination affects performance
- Pre-coating cleaning — ensuring adhesion of conformal coating (parylene, acrylic, silicone)
- Pre-packaging cleaning — final cleaning before encapsulation or molding
- Water-free environments — facilities with wastewater discharge restrictions
How It Works
Spray-Under-Immersion (SUI)
The assembly is immersed in liquid solvent while simultaneously being sprayed from multiple angles. Basket oscillation provides additional mechanical agitation. This combination forces solvent into micro-gaps, blind holes, and under low stand-off packages — achieving the cleaning effect that passive immersion alone cannot deliver.
Critically, this is achieved without ultrasonic energy. Ultrasonic cleaning can damage sensitive die, delaminate wire bonds, and crack ceramic packages. The SUI technology provides equivalent or superior cleaning power through fluid dynamics rather than acoustic cavitation.
Double-Flow Cleaning
The double-flow system delivers up to 300L/min (79 gal/min) of solvent through the cleaning chamber. Two independent flow paths ensure complete coverage of complex geometries — no shadow zones, no missed surfaces. The high flow rate also accelerates contaminant removal, reducing cycle time.
Vapor Rinsing
After the immersion/spray cleaning step, the assembly enters the vapor zone where clean solvent vapor condenses on the surface, providing a final rinse that removes any remaining film residue. Multiple vapor rinse cycles can be programmed for applications requiring higher cleanliness levels.
Solvent Management
Dual condensation systems and dual sealing minimize solvent volatilization — reducing consumable cost and worker exposure. The closed-loop design recycles solvent continuously, maintaining consistent cleaning performance across production lots.
Vapor SUI 2 vs. Other Cleaning Methods
| Feature | Vapor SUI 2 | Aqueous Spray | Open-Top Degreaser |
|---|---|---|---|
| Low stand-off cleaning (BGA, QFN) | Excellent | Limited — water can’t penetrate | Good — no spray assist |
| Ultrasonic damage risk | None — not required | None | Variable |
| Wastewater generation | None — water-free | Yes — requires treatment | None |
| Drying | Fast — solvent evaporates cleanly | Slow — requires oven/vacuum | Moderate |
| Solvent emissions | Minimal — dual sealing | N/A | High — open surface |
| Flow rate | 300L/min (79 gal/min) | Variable | N/A |
| Process flexibility | Multiple rinse cycles, programmable | Limited | Manual |
What to Send for an Application Review
To determine if the Vapor SUI 2 fits your process, include:
- Component types — package names, stand-off heights, pitch dimensions
- Contamination — flux type (rosin, water-soluble, no-clean), oils, adhesives
- Assembly dimensions — board size, component density, fixture requirements
- Cleanliness target — ionic contamination specs, visual requirements, coating adhesion
- Throughput — parts per hour, batch vs. continuous, shift schedule
- Constraints — floor space, utilities, solvent preferences, EHS requirements
Target Industries
- Semiconductor packaging (OSAT facilities)
- RF and microwave module assembly
- Aerospace and defense electronics
- Medical device electronics
- Hybrid microelectronics
- MEMS packaging
- Optoelectronics and photonics
Related Equipment
- NanoVapor — vacuum vapor phase for maximum penetration in blind holes and complex geometries
- Vapor SUI Mini — compact vapor phase for labs, prototypes, and small batches
- Hydro-clean LDS — aqueous PCBA cleaning for standard stand-off assemblies
- DI Water System — on-site deionized water generation for aqueous rinse