Ultra-precision flux cleaning for micro gaps; Cleaning of microwave components and microassembly modules; Pre-packaging cleaning for semiconductors; Post-lead-tinning component cleaning; Ideal for water-free cleaning requirements; Suitable for factories with strict wastewater discharge regulations.
Cleaning applications
- Micro gap ultra precision flux cleaning
- Cleaning of microwave components/micro assembly modules
- Cleaning before semiconductor packaging
- Cleaning of components after lead tinning
- Suitable for components that require water free cleaning
- Factory that does not allow wastewater discharge
Equipment features
- Suitable for solvent cleaning - (NPB), etc;
- Water free cleaning, cleaner is automatically recycled
- Built in filter to remove impurities, solvent recycling, and reduce costs
- Single layer refrigeration+120% free zone setting to reduce solvent loss VS2208
- Multiple cycles of vapor phase rinsing to improve process flexibility
- Unique condensation system+sealing system, strictly controlling solvent evaporation, and user-friendly human-machine environment
- The cleaning process can be flexibly set according to the cleaning needs
- Industrial computer control
- Customizable baskets and fixtures