
Remove various flux residues, clean small mechanical components, remove contamination from PCB production, and remove FOD. Clean high-density electronic components with low stand-off components, such as BGA, CSP.BTC, QFN, and MELF. Clean power devices and sensitive electronic devices, clean misprints with complex components, and clean before coating and bonding.
Cleaning applications
- Remove various flux residues
- Cleaning small mechanical components
- Cleaning contaminants in PCB production, remove FOD
- Clean high-density electronic components with low stand-off components, such as BGA, CSP, BTC, QFN, MELF
- Cleaning power devices
- Cleaning sensitive electronic devices
- Cleaning misprints with complex components
- Cleaning before coating and bonding
Equipment features
- Fully closed-loop system, zero discharge
- Triple cleaning capacity
- Linear direct spray technology can achieve consistent cleaning results
- 100% filtration of DI water
- Second rinse is optional
- Hot air knife drying
- Visual window for process control
- All process steps can be refined into up to 5 sub steps, achieving extremely high flexibility
- Multiple types of standard and customized PCBA fixtures
- Various stencil fixtures
- 3 completely independent liquid pipelines
- Low consumption of cleaning agents and DI water
- All process is equipped with liquid level sensors