TTM Technologies opened a $130M Ultra-HDI PCB facility in Syracuse, NY with $30M from the Department of War. The facility highlights a critical reality: building domestic defense electronics requires more than capital equipment—it demands a full process ecosystem for contamination control, component preparation, and assembly.
Stencil Cleaning vs. PCBA Cleaning: Different Problems, Different Solutions In a standard SMT assembly line, cleaning happens twice — once on the stencil and once on the board. They solve …
Last week, Bosch announced it has begun sample production of silicon carbide (SiC) chips at its Roseville, California, factory — the company’s first U.S. semiconductor production facility and a $2 …
On July 9, 2026, Micron CEO Sanjay Mehrotra posted on X that Micron is increasing its planned U.S. manufacturing and R&D investment to more than $250 billion through 2035, targeting …
New U.S. facilities for Ultra-HDI PCBs and advanced semiconductor packaging are closing a critical gap in the defense electronics industrial base — but the process ecosystems that make these components reliable still need building.
Vapor degreasing has been the gold standard for precision cleaning in electronics manufacturing for decades. Learn how modern closed-loop solvent systems work and why they matter for clean, dry parts in a single operation.
NVIDIA has booked over 50% of TSMC’s advanced packaging through 2027, and 98% of advanced semiconductor packaging is still offshore. What does that mean for defense, aerospace, and medical electronics manufacturers who need domestic process capability beyond the fab?
Micron begins producing the most advanced memory ever made in America, and NVIDIA pushes domestic manufacturing — but fabs alone don’t close the process capability gap. What defense, aerospace, and medical electronics manufacturers actually need to deliver on the Made in America promise.
TSMC and Amkor just signed a 10-year deal to build advanced packaging capacity in Arizona. The CHIPS Act is funding fabs across the country. But the real challenge isn’t building …
Every process engineer who has dealt with flux residue under a low stand-off package has run into the same wall: water doesn’t work. Learn why surface tension prevents water from cleaning under BGAs and why vapor-phase solvent cleaning is the solution.
