Amkor raised its Arizona advanced packaging campus to $12B and 93,000 m2 of cleanroom. Domestic OSAT capacity still depends on process capability: cleaning, bump and bond quality, solderability, and qualification.
Why Water Can’t Clean Under a BGA: The Surface Tension Problem Every process engineer who has dealt with flux residue under a low stand-off package has run into the same …
The Section 48D semiconductor tax credit lapses December 31, 2026. Domestic electronics manufacturing will need real process capability—cleaning, bonding, qualification, yield—not just capital investment.
Fab investment is pouring in, but the real constraint on Made in America is skilled process talent. With 67,000+ semiconductor jobs at risk of going unfilled, domestic electronics capability depends on people who can install, qualify, and run cleaning, bonding, and assembly processes at yield.
On March 26, 2026, Apple announced that Bosch, Cirrus Logic, TTD, and Qnity Electronics are joining its American Manufacturing Program (AMP) — a $400 million commitment through 2030 to produce …
In January 2026, the Trump administration imposed a 25 percent ad valorem tariff on certain advanced computing semiconductors under Section 232 of the Trade Expansion Act, citing the finding that …
Micron commits $250B and TSMC expands to $265B in U.S. semiconductor investment — but Made in America requires downstream process capability: contamination control, advanced packaging, legacy reconditioning, and full BOM traceability.
TSMC’s $265B Arizona investment is the largest foreign direct investment in U.S. history — but building fabs is only the visible part. The harder challenge is assembling the domestic process ecosystem that makes those fabs productive.
Executive Order 14415 requires defense contractors to trace every component and material back to its raw-material origin. For electronics manufacturers, that means real domestic process capability — not just a procurement checkbox.
Federal semiconductor tariffs, a new FAR rule banning covered semiconductors, and the FY2026 NDAA’s domestic sourcing deadlines are reshaping electronics manufacturing procurement. Here’s what process engineers and supply-chain teams need to know — and why domestic process capability matters more than labels.
