The Vapor SUI is meticulously crafted to meet customer cleaning specifications while leveraging our company's wealth of cleaning application expertise. It efficiently cleans electronic assemblies and precision mechanical components. Constructed from high-performance stainless steel, it endures heavy workloads while ensuring safety and environmental friendliness, minimizing solvent loss and cutting equipment operating costs. The fully closed-loop system of the Vapor SUI prevents any waste discharge.
Cleaning applications
- Bare chip cleaning
- Cleaning of 3D packaging components
- Micro gap ultra precision cleaning
- SIP and microwave component cleaning
- Cleaning before semiconductor packaging
- Cleaning before PCBA coating
- Clean electronic components with low stand-off components, such as FC, BGA, CSP, BTC, QFN, MELF, etc
- Suitable for components that require water free cleaning
- Factory that doesn't allow wastewater discharge
Equipment features
- The third generation co-solvent cleaning solution
- Unique spray under immersion technology, double flow cleaning technology, up to 500L/min
- Spray under immersion+Bubble+Basket oscillation, achieving ideal cleaning effect without ultrasonic (132kHz ultrasonic is optional)
- Water free cleaning process, suitable for bare chip cleaning, capable of rinsing clean organics
- Multiple cycles of vapor rinsing to improve process flexibility
- Dual condensation system+dual sealing, strictly control solvent volatilization, user-friendly
- The cleaning process can be flexibly set according to the cleaning requirment
- Customized baskets and fixtures