Heating plate series is apply to weld between component and substrate ,substrate and shell in process of microelectronics packaging and assembly such as: hybrid circuit、optical fiber electronic device.
Technical Parameter
- Square worktable can make sure widely effective heating area.
- Independent temperature control to ensure the welding process.
- Adjustable temperature can be set.
- Uniform temperature distribution of heating table.
- Equipment frame with heat insulation protection, avoid scalding.
- Reasonable structure is easy to operate and maintain.
Equipment Features
- Square worktable can make sure widely effective heating area.
- Independent temperature control to ensure the welding process.
- Adjustable temperature can be set.
- Uniform temperature distribution of heating table.
- Equipment frame with heat insulation protection, avoid scalding.
- Reasonable structure is easy to operate and maintain.