
There are two models available: single cleaning capacity Hydroclean LDS-S1 and double cleaning capacity Hydroclean LDS-S2.
Hydroclean LDS-S is mainly used for cleaning PCB assembly after soldering, power devices and small mechanical components, as well as before PCB coating. A special filtering system with high flow rate, which can be set as closed-loop or open-loop in the software, and fist rinse system and second rinse system are completely independent. The Hydroclean LDS-S has the same cleaning capacity as the Hydroclean LDS, and can be configured with a single or twingo frame. It adopts modular design, which allows for easy access to standard cargo elevators and convenient product maintenance.
Cleaning applications
- Remove various flux residues
- Cleaning small mechanical components
- Cleaning contaminants in PCB production, remove FOD
- Clean high-density electronic components with low stand-off components, such as FC, BGA, CSP, BTC, QFN, MELF
- Cleaning power devices
- Cleaning sensitive components
- Cleaning misprints with complex components
- Cleaning before coating and bonding
Equipment features
- Fully closed-loop system,zero discharge
- Linear direct spray technology can achieve consistent cleaning results
- 100% filtration of DI water
- Second rinse is optional
- Hot air knife drying
- Large process control visual window
- Multiple standard and customized PCBA fixtures
- Various stencil fixtures
- Completely independent liquid pipelines
- Low consumption of cleaning agents and DI water
- All process is equipped with liquid level sensors
- Excellent water utilization rate