Used for cleaning PCB after soldering, PCBA before coating, power devices and micro mechanical components. A special filtering system with high flow, which can be set as closed-loop or open-loop in the software, and the first rinse and second rinse system are completely independent.
Cleaning applications
- Remove various flux residues
- Cleaning small mechanical components
- Cleaning contaminants in PCB production, remove FOD
- Clean high-density electronic components with low stand-off components, such as FC, BGA, CSP, BTC, QFN, MELF
- Cleaning power devices
- Cleaning sensitive components
- Cleaning misprints with complex components
- Cleaning before coating and bonding
Equipment features
- Fully closed-loop spray in air system
- Linear direct spray technology can achieve consistent cleaning results
- 100% filtration of DI water
- Second rinse is optional
- Hot air knife drying
- Large process control visual window
- Multiple standard and customized PCBA fixtures
- Various stencil fixtures
- Completely independent liquid pipelines
- Low consumption of cleaning agents and DI water
- All process is with liquid level sensors
- Excellent water utilization rate