Wire Bonding Equipment
Wire Bonders for Semiconductor, RF, and Hybrid Microelectronics Assembly
Akrivis supplies semi-automatic and manual wedge bonding systems for laboratories, prototype lines, small-batch semiconductor assembly, RF/microwave modules, hybrid circuits, and high-reliability electronics manufacturing.
Equipment / Wire Bonding Equipment
Semi-Automatic Bonder
Manual Wedge Bonder
Gold / Aluminum Wire
Bonding MaterialsMicroelectronic Interconnects
Wire Bonding Connects Bare Die, Packages, Modules, and Hybrid Circuits
Wire bonding is a core semiconductor backend and microelectronics assembly process. Fine gold or aluminum wire creates electrical interconnects between semiconductor die, packages, substrates, RF modules, sensors, and hybrid circuits.
For high-reliability electronics, bond quality affects electrical continuity, pull strength, thermal cycling performance, RF behavior, and long-term field reliability. Akrivis helps teams match bonder capability to package geometry, wire material, production volume, and operator workflow.
Common Process Requirements
Featured Wire Bonding Systems
Choose the Right Bonder for Prototype, Laboratory, or Specialty Production Work
These systems serve environments where full high-volume automation is unnecessary, but process control, operator visibility, material compatibility, and bond repeatability still matter.
Semi-Automatic Bonder PW22
Flexible semi-automatic wire bonder for ball bonding, wedge bonding, gold wire, aluminum wire, and ribbon bonding applications in R&D, prototype, and small-batch production environments.
Manual Wedge Bonder M60W
Manual wedge bonding platform for specialized assemblies, process development, laboratory work, repair, hybrid circuits, and engineering teams needing direct operator control.
Process Fit
Useful Where Precision Matters More Than Commodity Throughput
Semiconductor Prototyping
Support bare-die development, package experiments, device qualification builds, and low-volume assembly before scale-up.
RF & Microwave Modules
Bond chip devices, substrates, hybrids, and module assemblies where interconnect consistency affects RF performance.
Hybrid Microelectronics
Enable assembly of mixed die, passives, sensors, substrates, and specialized packages for high-reliability applications.
Applications
Wire Bonding Applications Akrivis Supports
Wire bonders are often purchased around a specific device, substrate, or package. Akrivis can help review wire material, bond type, die/package access, operator workflow, and expected production volume before system selection.
Markets Served
Wire bonding remains essential wherever miniaturized, high-density, or bare-die electronics must be assembled with controlled interconnects.
Semiconductor Packaging
Backend package development, pilot builds, and specialty device assembly.
Aerospace & Defense
High-reliability microelectronics, RF assemblies, radar modules, and mission-critical systems.
Medical & Industrial Electronics
Specialized sensors, modules, and long-life electronics that require controlled assembly.
Research & Prototype Labs
Universities, failure analysis teams, device engineers, and low-volume innovation groups.
Application Review
Need Help Choosing a Wire Bonder?
Share your package, substrate, wire material, bond type, microscope/vision needs, and expected build volume. Akrivis can help determine whether a semi-automatic or manual wedge bonding system fits your process.