Applicable to SOP or QFP component lead cutting before forming
Major Function
Suitable for forming SOP or QFP devices
Equipment Features
- Dimension (L*W*H):590mm*570mm*950mm
- Weight : 150KG
- Component body size : 5*5mm-50*50mm
- Lead thickness : 0.10mm-0.30mm
- Lead length : 0.8mm-5mm
- Shear burr : ≤0.05mm
- lead repeat accuracy : ±0.01mm