Semi-Automatic Bonder PW22

The semi-automatic bonder PW22 is an ideal piece of equipment suitable for laboratory and small batch applications. It features easy operation and requires only blade replacement, and one bonding head can be used for either ball/wedge or wedge/wedge bonding modes. The convenient touchscreen interface allows for the exporting welding programs to flash drives for storage, with ample storage space available.

Manual Wedge Bonder M60W

The M60W is primarily utilized for wedge bonding across a range of applications including hybrid circuits, MCM multichip modules, optical devices, microwave devices, laser devices, and discrete devices. Featuring a height-adjustable workbench, it accommodates different wire bonding materials such as aluminum wire, gold wire, and gold ribbon. Additionally, it offers the capability to export bonding programs onto flash disks for convenient storage, boasting ample storage capacity.