Category: Automatic Forming System

APFL utilizes a precision servo electric forming press with adjustable bilateral forming molds, seamlessly linked to a computer serving as a data processing terminal. This setup allows for the precise adjustment of parameters, ensuring high-precision forming. It’s capable of shaping all pins of flat packaging devices, including those positioned at the top, middle, and bottom levels.

This is for the BOTTOM FORM – Automatic forming system adopting a precision servo-electric press and an adjustable double-side mold, can form all kinds of flat packages (top lead chip, middle lead chip and bottom lead chip). High-precision forming is achieved through adjustable parameters.