Why Water Can’t Clean Under a BGA: The Surface Tension Problem
Why Water Can’t Clean Under a BGA: The Surface Tension Problem Every process engineer who has dealt with flux residue under a low stand-off package has run into the same …
The CHIPS Tax-Credit Clock Is Ticking: ‘Made in America’ Depends on Process Capability, Not Just Investment
The Section 48D semiconductor tax credit lapses December 31, 2026. Domestic electronics manufacturing will need real process capability—cleaning, bonding, qualification, yield—not just capital investment.
Made-in-America’s Real Bottleneck Is Skilled Process Talent, Not Fab Investment
Fab investment is pouring in, but the real constraint on Made in America is skilled process talent. With 67,000+ semiconductor jobs at risk of going unfilled, domestic electronics capability depends on people who can install, qualify, and run cleaning, bonding, and assembly processes at yield.
Apple Expands Its American Manufacturing Program — But Who Will Package the Chips?
On March 26, 2026, Apple announced that Bosch, Cirrus Logic, TTD, and Qnity Electronics are joining its American Manufacturing Program (AMP) — a $400 million commitment through 2030 to produce …
Section 232 Semiconductor Tariffs: What Domestic Manufacturers Actually Need to Build
In January 2026, the Trump administration imposed a 25 percent ad valorem tariff on certain advanced computing semiconductors under Section 232 of the Trade Expansion Act, citing the finding that …
Micron $250B, TSMC $265B, and the Process Capability Gap Behind Made in America Semiconductors
Micron commits $250B and TSMC expands to $265B in U.S. semiconductor investment — but Made in America requires downstream process capability: contamination control, advanced packaging, legacy reconditioning, and full BOM traceability.
TSMC’s $265B Arizona Bet and the Domestic Packaging Gap: What Electronics Manufacturers Actually Need to Build
TSMC’s $265B Arizona investment is the largest foreign direct investment in U.S. history — but building fabs is only the visible part. The harder challenge is assembling the domestic process ecosystem that makes those fabs productive.
New Defense Supply Chain Executive Order Demands Domestic Process Capability — Not Just a “Made in America” Label
Executive Order 14415 requires defense contractors to trace every component and material back to its raw-material origin. For electronics manufacturers, that means real domestic process capability — not just a procurement checkbox.
Semiconductor Tariffs, FAR Procurement Bans, and the NDAA: What Domestic Electronics Manufacturers Need to Know in 2026
Federal semiconductor tariffs, a new FAR rule banning covered semiconductors, and the FY2026 NDAA’s domestic sourcing deadlines are reshaping electronics manufacturing procurement. Here’s what process engineers and supply-chain teams need to know — and why domestic process capability matters more than labels.
NVIDIA’s First ‘Made in America’ GPUs Ship to Taiwan for Packaging — Why Domestic Process Capability Still Matters
On July 27, 2026, NVIDIA and TSMC hit what WCCFTech reported as a milestone for U.S. semiconductor manufacturing: the first NVIDIA GB300 AI GPUs fabricated on TSMC’s 4nm node rolled …