Equipment catalog
Process equipment organized by manufacturing problem.
Akrivis supports specialized electronics manufacturing equipment for cleaning, lead preparation, wire bonding, tinning, thermal processing, and related production-floor process gaps.
Primary equipment groups
Six categories, one practical buying path.
Use this page as a technical starting point. Each category leads to the relevant equipment family and product pages; if the application is unusual, start with an application review rather than guessing at a machine.
Cleaning & contamination control
Vapor phase cleaning, aqueous spray cleaning, DI-water support, and process equipment for assemblies where residue, particles, and cleanliness requirements drive yield or reliability.
- PCB, SMT, stencil, and micro-assembly cleaning
- Precision degreasing and residue removal
- Cleaning process selection support
Lead forming & component preparation
Automatic, semi-automatic, pneumatic, and fixed-mold systems for preparing through-hole, flat-pack, and specialty components before assembly.
- Lead forming, cutting, and reconditioning
- DIP, DPAK, omega, bottom-lead, QFP/SOP forming
- Legacy component preparation
Wire bonding equipment
Manual and semi-automatic bonding systems for hybrid, microelectronics, sensor, RF, and package-level process work.
Component tinning equipment
Equipment for solderability restoration, component tinning, and lead-condition recovery where material condition and process control matter.
Heating plate & thermal process equipment
Thermal, split-type, and vacuum heating equipment for controlled process steps, lab work, and specialty electronics manufacturing needs.
Parylene & specialty process equipment
Related process equipment for narrow manufacturing requirements that do not fit neatly into a standard catalog category, including parylene coating and adjacent assembly-process tools.
Not sure which category fits?
Send the part, process, cleanliness target, throughput range, or equipment constraint. Akrivis can help narrow the category before you spend time comparing the wrong machine family.
Manufacturer technology base
More product depth than the old catalog showed.
Akrivis represents and supports specialized electronics manufacturing equipment from established manufacturing partners including Purbest Technology. The value for buyers is practical access to the right process family—cleaning, lead preparation, bonding, tinning, or controlled heating—matched to the actual assembly requirement.
Equipment examples shown are representative of Purbest manufacturing capabilities available through Akrivis application review.
Vacuum vapor phase cleaningFor micro-assembly, SIP, microwave, and precision residue-removal applications.
Hydro-clean PCBA cleaningBatch and larger-format aqueous cleaning families for populated assemblies.
Automatic lead formingAPFL/SAPFL/PFL equipment families for flat-pack, through-hole, and specialty lead preparation.
Lead reconditioningQFP/SOP lead-condition recovery and legacy component support applications.
Controlled heatingMicro-assembly, vacuum, and specialty heating-plate process equipment.
Wire bondingManual and semi-automatic wedge bonding equipment for lab and production workflows.Selection workflow
Choose by process, not just by machine name.
Information that helps
What to send before requesting a quote.
A short technical description usually saves more time than a long email chain. Include whichever details are available.
Application review
Have a specific equipment problem?
Send the application details and Akrivis will help identify the most relevant equipment family or next technical question.