The Vapor SUI Inline 2 is an inline vapor phase cleaning system designed for automated production environments. With dual independent cleaning chambers and automatic loading/unloading, it connects directly to upstream and downstream processes — delivering continuous water-free cleaning without manual handling.

Vapor SUI Inline 2 inline vapor phase cleaning system

Why Vapor SUI Inline 2 Exists

Batch vapor phase cleaning requires manual loading and unloading — the operator places parts in a basket, runs the cycle, and removes them. In high-throughput production, this manual step becomes a bottleneck. The Vapor SUI Inline 2 eliminates it with conveyor-based automatic loading, dual-chamber operation, and direct integration with production line flow.

Key Specifications

ConfigurationInline — conveyor-based automatic loading/unloading
Cleaning ChambersTwo independent chambers — approximately double cleaning capacity
ThroughputHigher than batch systems — continuous production flow
Process TypeWater-free vapor phase cleaning
Line IntegrationEasy connection with upstream and downstream production lines
ControlFlexible process configuration per cleaning requirement
CustomizationCustom baskets and fixtures available

Control System: Windows OS with touchscreen HMI — programmable recipe storage/recall, cycle data logging, password-protected process parameters, and exportable production records for traceability (IPC-6012, MIL-STD-883, AS9100).

Applications

  • Bare chip cleaning — surface preparation before wire bonding or die attach
  • 3D packaging component cleaning — stacked die with micro-gap interconnections
  • Micro-gap precision cleaning — stand-off gaps below 0.3mm (0.012″)
  • Pre-packaging cleaning — before encapsulation or molding
  • Pre-coating cleaning — ensuring conformal coating adhesion
  • Low stand-off components — FC, BGA, CSP, BTC, QFN, MELF packages
  • Continuous production — automated lines requiring uninterrupted cleaning flow
  • High-throughput environments — where batch cycle time is a bottleneck

How It Works

Dual-Chamber Design

Two independent cleaning chambers operate simultaneously, providing approximately double the cleaning capacity of single-chamber systems. Parts enter one chamber while the other is in its cleaning cycle, maintaining continuous flow.

Automatic Loading/Unloading

Conveyor-based part handling eliminates manual basket loading. Parts are placed on the infeed conveyor, cleaned in the dual chambers, and exit on the outfeed conveyor — ready for the next process step.

Line Integration

The inline configuration connects directly with upstream equipment (e.g., reflow oven, die attach) and downstream equipment (e.g., inspection, conformal coating). This creates a continuous process flow without intermediate handling or storage.

Batch vs. Inline: When to Choose

FactorBatch (Vapor SUI 2)Inline (Vapor SUI Inline 2)
Manual handlingYes — basket load/unloadNo — automatic conveyor
ThroughputBatch cycle timeContinuous flow
Line integrationStandaloneDirect upstream/downstream connection
Product mixFlexible — change basketsOptimized for consistent product
Floor spaceSmaller footprintLarger — needs conveyor path
Operator dependencyHigherLower

Related Equipment

  • Vapor SUI 2 — batch spray-under-immersion for flexible production
  • NanoVapor — vacuum vapor phase for maximum penetration
  • Hydro-clean LDS — aqueous PCBA cleaning for standard stand-off assemblies