- The machine design makes HFE compliance difficult (high emissions, no containment)
- Upgrading to a modern closed-loop system is typically the most practical path
- Closed-loop systems with built-in distillation, dual condensation, and sealing minimize solvent loss and emissions
If you’re considering aqueous cleaning as an alternative:
- Aqueous works for standard-profile SMT assemblies
- It does not solve the low stand-off cleaning problem (BGA, QFN, flip-chip)
- Wastewater treatment adds ongoing operational cost and regulatory burden
If you need vapor-phase cleaning for low stand-off components:
- HFE-based closed-loop vapor degreasers are the compliant path forward
- Co-solvent capability handles the toughest residues while staying within regulatory limits
- On-site solvent distillation and recycling reduce consumable costs
The transition from nPB to compliant alternatives is not just a chemistry swap — it’s an equipment decision. Modern closed-loop systems are designed for the new-generation solvents and regulatory environment. Retrofitting old open-top equipment with new chemistry often doesn’t solve the emissions and compliance problems.
This article is part of Akrivis’s technical resources for electronics manufacturing process evaluation. For equipment specifications, application reviews, or process consultation, contact the Akrivis team.
Have a cleaning or solvent transition question? Contact the Akrivis team for an application review and equipment recommendation for your specific process requirements.
Published by Akrivis Components and Tools — North American distributor for PurBest electronics manufacturing process equipment.
