The Problem This Machine Solves
Gold-plated leads on QFP, SOP, and QFN components create solderability problems. Gold dissolves into solder during reflow, forming brittle gold-tin intermetallic compounds (AuSn4) that weaken solder joints and cause premature failure under thermal cycling. The fix is gold removal and re-tinning — stripping the gold layer and replacing it with a controlled solder coating. But doing this manually on high-volume production lines is slow, inconsistent, and introduces variability that no quality system can tolerate.
High-Capacity Automated Gold Removal
The Hyper Tinning machine is designed for high-capacity, high-precision gold removal and tinning of QFP, SOP, QFN, and similar packages. It combines visual recognition technology with automated motion control to process components at production speeds — removing gold plating and applying uniform solder coating in a single pass.
Unlike manual tinning stations where operators dip components by hand, the Hyper Tinning delivers consistent flux application, immersion time, and solder bath temperature across every component. The result: uniform tin coating thickness, controlled lead geometry, and repeatable solderability — shift after shift.
Key Specifications
| Primary Function | Gold removal and re-tinning of component leads |
| Supported Packages | QFP, SOP, QFN, side lead-out, bottom pad packages |
| Motion Control | High-precision automated motion mechanism |
| Visual System | Visual recognition and compensation technology |
| Process Control | Computer-managed process flow and parameter control |
| Automation Level | Automated component handling — higher throughput production |
| Application | Gold removal, tinning, rework of solder bridge defects |
Applications
- QFP gold removal — stripping gold plating from quad flat pack leads and re-tinning with controlled solder coating
- SOP gold removal — small outline package lead tinning for solderability restoration
- QFN re-tinning — bottom pad and exposed thermal pad tinning for reflow-compatible surfaces
- Side lead-out packages — tinning of gull-wing and J-lead configurations
- Bottom pad packages — tinning of QFN/DFN exposed pads
- Solder bridge rework — re-tinning of components with solder bridge defects from reflow
- High-volume production — automated tinning for production lines processing hundreds of components per hour
- Lead-free compatibility — tin coating compatible with lead-free reflow profiles
How It Works
Step 1 — Component Loading: Components are loaded into the machine’s feeding system. The visual recognition system identifies component orientation and lead position, compensating for any misalignment in the feeding mechanism.
Step 2 — Flux Application: Component leads are coated with flux to promote solder wetting and prevent oxidation during the tinning process. Flux type and application thickness are computer-controlled for consistency.
Step 3 — Gold Removal and Tinning: Fluxed leads are immersed in a controlled-temperature solder bath. The gold dissolves into the solder (diluted below the embrittlement threshold), and a uniform tin coating is deposited on the leads. Immersion time, bath temperature, and withdrawal speed are all process-controlled parameters.
Step 4 — Inspection and Output: The visual system verifies coating uniformity and lead geometry. Finished components are outputted with consistent, documented tinning quality.
Hyper Tinning vs. Alternatives
| Feature | Hyper Tinning | Super Tinning | Manual Dip Tinning |
|---|---|---|---|
| Throughput | High — automated production speed | Medium — semi-automatic | Low — operator dependent |
| Visual recognition | Yes — auto compensation | No | No |
| Process control | Computer-managed — all parameters logged | Manual settings | Operator controlled |
| Gold removal | Optimized — high-capacity | Basic | Inconsistent |
| QFN bottom pad | Yes — designed for it | Limited | Difficult |
| Solder bridge rework | Yes — integrated | No | Manual rework |
| Coating uniformity | High — controlled immersion | Good | Poor — varies by operator |
What to Send for a Quote
- Component types — QFP, SOP, QFN, package sizes and lead counts
- Gold plating spec — gold thickness if known (typically 0.5–2.0 µin)
- Tin coating spec — target thickness and alloy (SnPb or lead-free SnAgCu)
- Throughput requirement — components per hour or shift
- Lead-free requirement — SnPb, lead-free, or both
- Rework needs — solder bridge rework frequency
- Quality spec — IPC-J-STD-002, MIL-STD-883, or internal spec
Target Industries
Semiconductor packaging, OSAT facilities, high-reliability electronics assembly, defense/aerospace, medical devices, telecommunications, any facility processing gold-plated components at production volumes.
Related Equipment
- Super Tinning — semi-automatic tinning for lower-volume production and component-level tinning
- Hydro-clean AS — post-tinning cleaning to remove flux residue before assembly
- NanoVapor — precision cleaning of tinned components before wire bonding or die attach