Solder with Superior Performance – Our Advanced Solder Solutions for Demanding Applications
Exceptional electronics require exceptional solder. As products become smaller, faster and more complex, solder plays an increasingly critical role. Substandard solder can lead to cracked joints, interconnect failure, overheating and field returns. With over 50 years of solder innovation, our company delivers advanced solder pastes, wires, powders and more for the most demanding applications.
For surface mount assembly, our innovative solder pastes promote rapid wetting, excellent printability and void-free solder joints with no graping or mid-chip beads. We offer Type 3, 4, 5 and 6 powder options including SAC305, Sn/Ag/Cu, Sn/Ag and more. Our solder pastes for SMT excel in the latest high-speed pick and place and reflow processes.
Die attach solder pastes must withstand extreme thermomechanical stresses. Our specialized die attach pastes promote void-free bonding and reliable thermal cycling performance. We offer eutectic tin/lead, gold/tin and other alloys for die attach applications.
Power electronics generate significant heat which requires solder that resists thermal fatigue and creep corrosion. Our solder pastes for power electronics promote electrical efficiency and long-term reliability. We offer high lead, silver and copper alloys capable of high temperature operation.
For advanced packaging applications like 2.5D/3D integration, our fine pitch solder pastes enable interconnects down to 0.05mm with accurate deposition and consistent reflow. We offer fluxes engineered for the latest Cu pillar, TSV and high density interconnect technologies.
Mini and micro-LED displays demand extremely accurate deposition of tiny solder bumps. Our specialized LED solder pastes promote defect-free bonding of mini/micro LED dies to circuit boards. We offer particle-free options for fine feature filling.
Beyond solder paste, we offer fluxless solid core solder wire, spheres and perform for applications where flux residue is prohibited. Our engineers can customize the solder alloy, flux core, diameter and spool packaging to your specifications.
With strict quality control and lot traceability, our advanced solder solutions promote defect-free interconnections, electrical conductivity, thermal transfer, and long-term reliability. Our solder paste printing, reflow profiling and alloy development expertise will help you optimize the solder process for your application. Contact our technical team today to discuss your requirements. We manufacture a wide range of standard and custom solder materials ideal for your most demanding semiconductor, automotive, aerospace, medical, military and telecommunications applications. Your success is our mission.