An ideal solution for cleaning 3D IC packages and low stand-off components like the bottom of BGAs and FCs. The built-in vacuum distillation unit ensures a constant supply of clean solvents, with options for continuous or complete distillation modes. Controlled via a computer and touchscreen interface, it provides process data display and real-time recording, offering an intuitive, convenient, and user-friendly operation experience.
Ultra-precision flux cleaning for micro gaps; Cleaning of microwave components and microassembly modules; Pre-packaging cleaning for semiconductors; Post-lead-tinning component cleaning; Ideal for water-free cleaning requirements; Suitable for factories with strict wastewater discharge regulations.
PFL-FM fixed mold forming machine is ideal for high-volume SOP/QFP molding, allowing molding cuts at the top, middle, and bottom lines of components. Featuring a scanning gun for rapid core identification, it ensures easy mold core replacement tailored to specific component types.
Hydroclean LDS-S is mainly used for cleaning PCB assembly after soldering, power devices and small mechanical components, as well as before PCB coating. A special filtering system with high flow rate, which can be set as closed-loop or open-loop in the software, and fist rinse system and second rinse system are completely independent. The Hydroclean LDS-S has the same cleaning capacity as the Hydroclean LDS, and can be configured with a single or twingo frame. It adopts modular design, which allows for easy access to standard cargo elevators and convenient product maintenance. There are two models available: single cleaning capacity Hydroclean LDS-S1 and double cleaning capacity Hydroclean LDS-S2
APFL utilizes a precision servo electric forming press with adjustable bilateral forming molds, seamlessly linked to a computer serving as a data processing terminal. This setup allows for the precise adjustment of parameters, ensuring high-precision forming. It’s capable of shaping all pins of flat packaging devices, including those positioned at the top, middle, and bottom levels.
The semi-automatic bonder PW22 is an ideal piece of equipment suitable for laboratory and small batch applications. It features easy operation and requires only blade replacement, and one bonding head can be used for either ball/wedge or wedge/wedge bonding modes. The convenient touchscreen interface allows for the exporting welding programs to flash drives for storage, with ample storage space available.
This is for the BOTTOM FORM – Automatic forming system adopting a precision servo-electric press and an adjustable double-side mold, can form all kinds of flat packages (top lead chip, middle lead chip and bottom lead chip). High-precision forming is achieved through adjustable parameters.
The PFL-FM fixed mold forming machine is ideal for mass-producing components like SOP/QFP molding. It can achieve molding cuts at the top, middle, and bottom lines of the component. Equipped with a scanning gun, it swiftly identifies the core. Mold core replacement is straightforward, with each mold core corresponding to a specific type of component molding.
The PFL can shape various two-side and four-side pack chips into a gull-winged configuration, catering to diverse lead forming and cutting needs. This cost-effective equipment is well-suited for multi-variety and small-batch production scenarios, such as those found in research institutes or universities.
The PFL\DPAK Pneumatic Forming Machine is tailored for shaping DPAK components with adjustable parameters, capable of forming them into a gull-winged shape. This equipment pre-processes components for easy assembly, featuring a pneumatic die press for optimal precision and consistency. It streamlines component completion and forming simultaneously.
